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ELECTROTHERMAL
DESIGN

ELECTROTHERMAL
DESIGN

INDUSTRIAL ENCLOSURES FOR HIGH-POWER ELECTRONICS.

Thermal Analysis
Enclosure Design
Cooling Solutions
Experimental Validation

Thermal Analysis

When in doubt,

SIMULATE

SIMULATE

Using a blend of finite element analysis (FEA)

and computational fluid dynamics (CFD), ETD unlocks a "Gods-eye-view" into the underlying thermodynamics of your design.

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Enclosure Design

Form

Compact, lightweight, sleek, versatile.

Tailor made enclosures to meet any and all project constraints.

Fit

Modularized, standardized, assemblability. Efficient electromechanical layouts for seamless interconnectivity.

Function

Ruggedized and thermally sound.

Industrial housings, built to perform in any conditions.

Cooling Systems

Custom Cooling Solutions

Experimental Validation

FAQ
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FAQ

  • Do you provide thermal analysis for existing products?
    Yes. ETD can perform thermal analysis at any stage of the design process: rough concept, early stage prototype, or finished product.
  • Does the enclosure design service include the sourcing and purchasing of the metalwork?
    ETD offers to source quotes on all metalwork as an optional feature of the enclosure design service. However, the customer is solely responsible for the execution of the quotes. ETD does not handle purchasing.
  • What are the differences between the thermal analysis and the experimental validation services?
    The differences between these two services are as follows: While highly accurate (+/- 10% margin of error typically) the thermal analysis service is simulation driven, and is therefore theoretical. The thermal validation service is a real-world experiment, yielding data that is more reliable. Thermal analysis can be performed without any physical material (metal parts, electronic components, etc.), while thermal validation requires a fully functioning unit. Thermal analysis can generate virtually infinite amounts of data points across a wide variety of data sets such as solid/fluid temperature, fluid velocity, pressure, etc. Thermal validation provides a finite, yet definitive, number of thermal data points. Thermal analysis is less energy intensive, and therefore lower cost than thermal validation.
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